Our Products

SDS are available upon request. Please contact us

  1. E10-104

    One part epoxy, heat cure, pure silver filled.

    Product Specs

    • Volume Resistivity: 0.001
    • Open Time: 6 Months at Room Temperature
    • Cure Schedule: 2 hr. @125°C; 1 hr. @150°C; 30 Min. @175°C
    • Mix Ratio: N/A
  2. E10-102

    One part epoxy, heat cure, Nickel filled.

    Product Specs

    • Volume Resistivity: 0.038
    • Open Time: 6mth @RT
    • Cure Schedule: 2hr @125ºC; 1hr @ 150ºC; 1/2hr @175C
  3. E10-101

    Pure silver filled electrically conductive epoxy

    Two-part epoxy 

    Room temperature cure 

    Recommeded For: Electronic bonding and sealing applications

    Appplications Include:

    • Microwave EMI & RFI shielding
    • Assembly or repair of printed circuit boards
    • Wave guides
    • Electronic modules
    • Flat cable,
    • High frequency shields,
    • Connections
    • Circuitry
    • Cold solder for high-sensitive components where hot-soldering is impractical

    Bonds to: aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.

    Product Specs

    • Volume Resistivity: 0.0001
    • Open Time: 1hr @RT
    • Cure Schedule: 24hr @RT; 45min @50ºC;15min @100º
    • Mix Ratio: 1:20 by weight
  4. AL428

    Two part, heat-resistant and low exotherm, epoxy adhesive formulation. 

    Product Specs

    • Volume Resistivity: -
    • Open Time: 20-30 min
    • Cure Schedule: 20 min. @ 177C; 30 min. @ 121C; 80 min. @ 93 C; 4-6 hours @ 66C

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