Our Products

SDS are available upon request. Please contact us

  1. E40-401

    low viscosity resin system especially designed for the potting and encapsulation of miniaturized electronic components.                                                

    Product Specs

    • Volume Resistivity: -
    • Open Time: 60 Min.
    • Cure Schedule: -
  2. E40-403

    general purpose potting and casting resin that is reinforced with fiberglass for large unit encapsulation

    Product Specs

    • Volume Resistivity: -
    • Open Time: 6-8 Hrs.
    • Cure Schedule: Room temp: 8-12hrs
  3. E40-405

    Low weight epoxy casting and potting resin.

    Product Specs

    • Volume Resistivity: -
    • Open Time: 40 Min.
    • Cure Schedule: Room temp. overnight
  4. E40-406

    general- purpose rigid epoxy encapsulant

    Product Specs

    • Volume Resistivity: -
    • Open Time: 30 Min.
    • Cure Schedule: Room temp. overnight
  5. E40-407

     high impact, low viscosity, room temperature
    curing, epoxy, casting, potting, and encapsulating system.                                                                   

    Product Specs

    • Volume Resistivity: -
    • Open Time: 80 Min.
    • Cure Schedule: 24 hrs. @ RT
  6. E40-408

    general purpose epoxy casting, potting and encapsulating resin system

    Product Specs

    • Volume Resistivity: 3.5 x 1014
    • Open Time: 20 Min.
    • Cure Schedule: -
  7. E40-409

    general purpose epoxy casting, potting and encapsulating resin system

    Product Specs

    • Volume Resistivity: 3.5 x 1014
    • Open Time: 30 Min.
    • Cure Schedule: -
  8. E40-410

    two part, long pot life, solvent free epoxy formulation designed to meet the most critical electronic encapsulating requirements. 

    Product Specs

    • Volume Resistivity: -
    • Open Time: 40 min
    • Cure Schedule: 145 C. 2hrs
  9. E40-411

    two parts, solvent free Epoxy formulation designed to meet all the requirements for L.E.D. encapsulation

    Product Specs

    • Volume Resistivity: 4.0 x 1014
    • Open Time: 40min
    • Cure Schedule: -
  10. E40-412

    Thermally Conductive Epoxy Casting, Potting And Adhesive Resin System

    Product Specs

    • Volume Resistivity: 4.9 x 1016
    • Open Time: -
    • Cure Schedule: -
  11. E40-413

    Fire Retardant and Room Temperature Curing Epoxy Resin System For Potting, Casting, And Encapsulation

    Product Specs

    • Volume Resistivity: 2.1 x 1015
    • Open Time: 75 min
    • Cure Schedule: 24hrs@RT
  12. E40-414

    Highest Heat Resistant, Aluminum Filled, Epoxy Casting Resin

    Product Specs

    • Volume Resistivity: -
    • Open Time: -
    • Cure Schedule: 12hrs@RT
  13. E40-415

    Flexible, 38 Shore D Hardness, Two-Component Epoxy Potting Compound and Adhesive

    Product Specs

    • Volume Resistivity: 4.1 x 1014
    • Open Time: 6 min
    • Cure Schedule: 24hrs@R
  14. E40-416

    Thixotropic, Two-Component Epoxy Structural Adhesive Potting Compound

    Product Specs

    • Volume Resistivity: -
    • Open Time: 60 min
    • Cure Schedule: 24hrs@RT or 1hr@150°F
  15. E40-417

    Low Cost, General-Purpose, Two-Component Epoxy, Casting and Potting Compound

    Product Specs

    • Volume Resistivity: -
    • Open Time: 40 min
    • Cure Schedule: 24hrs@RT or 2hr@220°F

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