Our Products

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  1. E10-101

    Pure silver filled electrically conductive epoxy

    Two-part epoxy 

    Room temperature cure 

    Recommeded For: Electronic bonding and sealing applications

    Appplications Include:

    • Microwave EMI & RFI shielding
    • Assembly or repair of printed circuit boards
    • Wave guides
    • Electronic modules
    • Flat cable,
    • High frequency shields,
    • Connections
    • Circuitry
    • Cold solder for high-sensitive components where hot-soldering is impractical

     

    Bonds to: aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.

    Product Specs

    • Volume Resistivity: 0.0001
    • Open Time: 1hr @RT
    • Cure Schedule: 24hr @RT; 45min @50ºC;15min @100ºC
    • Mix Ratio: 1:20 by weight
  2. E10-101LP

    Pure silver filled electrically conductive epoxy

    Two-part epoxy

    Long open time & Room Temperature Cure

    Recommeded For: electronic bonding and sealing applications that require both fine electrical and mechanical properties.

    Applications Include:

    • Microwave EMI & RFI shielding 
    • In the assembly or repair of printed circuit boards
    • Wave guides 
    • Electronic modules
    • Flat cable
    • High frequency shields
    • Connections
    • Circuitry 
    • Cold solder for high-sensitive components where hot-soldering is impractical

     

    Bonds to: aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.

    Product Specs

    • Volume Resistivity: 0.0001
    • Open Time: 3 Hours at RT
    • Cure Schedule: 24hr @RT; 45min @50ºC;15min @100ºC
    • Mix Ratio: 100: 6
    • Viscosity: Paste
  3. E10-104

    Pure Silver filled Elecetrically conductive Epoxy

    One Part & Heat Cure 

    High Temperature Resistant

    Excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175°C

    Outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C.

    Applications Include: 

    • Used for chip bonding in micro and opto-electronic hybrid circuit fabrication
    • Microwave applications for EMI and FRI shielding,
    • For assembly and repair of circuit boards 
    • Electronic component manufacturing

     

    *Available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques. 

    Product Specs

    • Volume Resistivity: 0.0005
    • Open Time: 6mth. @RT
    • Cure Schedule: 2hr @125°C; 1hr @150°C; 1/2hr @175°C
  4. E10-106

     Low Cost, two part, room temperature cure, pure silver and silver coated ceramic filled.

    Product Specs

    • Volume Resistivity: 0.0015
    • Open Time: 1hr @RT
    • Cure Schedule: 24hr @RT; 45min @50°C; 15min @100°C
  5. E10-108

    Flexible, Two-Part, room temperature cure, pure silver filled.

    Product Specs

    • Volume Resistivity: 0.0001
    • Open Time: 3hr @RT
    • Cure Schedule: -
  6. E10-120

    Two-part epoxy,long open time,pure silver filled.

    Product Specs

    • Volume Resistivity: 0.0001
    • Open Time: 6 Hours at Room Temp.
    • Cure Schedule: 1hr @60ºC; 24hr @RT followed by 10min @60ºC
    • Mix Ratio: See TDS
    • Viscosity: Paste
  7. E1072

    Low cost, light weight, silver coated glass sphere epoxy 

    Product Specs

    • Volume Resistivity: 0.006
    • Open Time: 1hr @RT
    • Cure Schedule: 8hr @RT 20min @60ºC
  8. AL906-06

    Designed to replace LOCTITE 3880, low ion, One-part, heat cure, silver filled epoxy

    Product Specs

    • Volume Resistivity: <0.0007
    • Open Time: 6 Months
    • Cure Schedule: 15min @130ºC
    • Mix Ratio: N/A
    • Viscosity: Paste
  9. 61CV1

    An air dry electrically conductive , One-part, silver filled epoxy.

    Product Specs

    • Volume Resistivity: 0.0003
    • Open Time: 6 Hours at Room Temp.
    • Cure Schedule: 0.7 Hrs @ 200°C; 1.5 Hrs @ 180°C; 2.5 Hrs @ 160° C
    • Mix Ratio: N/A
    • Viscosity: See TDS
  10. 61CV2

    Low cost, silver coated glass spheres filled One-part epoxy.

    Product Specs

    • Volume Resistivity: 0.0003
    • Open Time: 6 Months at Room Temp.
    • Cure Schedule: 0.7 Hrs @ 200°C; 1.5 Hrs @ 180°C; 2.5 Hrs @ 160° C
    • Mix Ratio: N/A
    • Viscosity: See TDS

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